An industry landing page written for a family-run manufacturer re-announcing itself in the electronics space. I built the structure, sourced material from internal spec sheets and part lists, and balanced procurement-level precision with SEO discoverability. The result supports vendor evaluation for OEMs sourcing tight-tolerance insulating, conductive, and adhesive components.
Role: Sole author
Audience: Sourcing engineers, technical buyers, product designers
Use Case: Mid-funnel lead qualification
Best Electrical Component Die Cutting Services
Since Colvin-Friedman was founded right after World War II, we have invested our time and labor into producing components for the nascent high-tech world. Today, we have more than 75 years of experience in die-cutting for the electronics industry and we’re proud to have been a part of the first TVs up to the cutting edge of technology in the 21st century.
However, while die cutting may be used for high-speed runs for different materials used in electronics manufacturing, that speed can never be at the expense of accuracy and precision. Below are some of the most common materials that we die-cut for our electronics manufacturing clients.
Die Cutting Capabilities by Material Type
| Material Type | Products | Example Materials | Preferred Die Cutting Method |
|---|---|---|---|
| Insulating Materials | Sheets, gaskets, transformer/motor insulation | Mylar, Nomex, Kapton | Flat press for precision cuts; rotary for high-volume simpler shapes |
| Conductive Materials | EMI/RFI gaskets, electrodes, foil connectors | Copper foil, aluminum foil, conductive rubber | Flat press for intricate patterns; rotary for consistent shapes |
| Adhesive Materials | Tapes, thermal interfaces, cable management | Acrylic adhesives, silicone sheets, labels | Rotary for high volume; flat press for complex shapes |
| Plastic & Polymer Films | Membrane switches, touchscreen covers, sleeves | Polycarbonate, PET, PTFE | Rotary for thin films; flat press for thicker or intricate materials |
| Foam Materials | Vibration pads, thermal insulators, acoustic layers | PU foam, EPDM, melamine | Flat press for thicker foam; rotary for thinner foam production |
Best Practices for Electronics Die Cutting
With such disparate material types, it may seem difficult to imagine that one die cutter has the experience to work with each, given different characteristics like tensile strength, flexibility, resistance to heat, and even conductivity. However, we have developed a set of best practices for each material type.
Insulating Materials
| Issue | Colvin-Friedman’s Best Practice |
|---|---|
| Maintaining precise tolerances | Use depth-controlled equipment, regular calibration, and thickness gauges |
| Preventing contamination | Cleanroom handling protocols, dust-free storage, dedicated material handling |
| Avoiding fraying/delamination | Sharp dies, optimized cutting pressure and speed, specialized dies for composites |
Conductive Materials
| Issue | Colvin-Friedman’s Best Practice |
|---|---|
| Avoiding oxidation | Use inert gas shielding, protect packaging, climate-controlled storage |
| Maintaining conductivity | Minimize burring, consider edge treatments (e.g., plating) |
| Preventing static buildup | Antistatic workstations, grounded equipment, ionizing blowers |
Adhesive Materials
| Issue | Colvin-Friedman’s Best Practice |
|---|---|
| Adhesive bleed | Chilled dies and surfaces, monitored cutting environment |
| Clean release | Release coatings, surface cleaning protocols |
| Post-cut adhesion consistency | Controlled temp/humidity, adhesive integrity QC at multiple stages |
Plastics and Polymer Films
| Issue | Colvin-Friedman’s Best Practice |
|---|---|
| Static cling | Ionizers, anti-static additives |
| Tearing | Vacuum tables, sharp dies, material-specific speed thresholds |
| Dimensional stability | Monitor humidity/temp, use of backing layers |
Foam Materials
| Issue | Colvin-Friedman’s Best Practice |
|---|---|
| Density consistency | Specialty foam dies, optimized blade angles, calibrated stroke depth |
| Compression set | Minimal pressure cutting, rest period before packaging |
| Clean cuts on open-cell foams | Sharp dies, monitored feed rate, adjusted pressure |
Key Things to Know – Colvin-Friedman Electronic Die Cutting
- Tight Tolerance Levels: Our tooling maintains the high precision required for gaskets, shields, and micro-layered structures.
- Material Compatibility: We cut copper foil, polyimide, silicone adhesive, and more — without dimensional distortion or edge fray.
- Flexible Electronics Applications: We die-cut circuits that flex, fold, or embed into layered substrates.
- ESD Protection: Grounding mats, ionization, and static-safe workflows protect sensitive assemblies.
- Multi-Functional Laminate Conversions: We produce adhesive gaskets with conductive or thermally dissipative cores.
Get Your Electronics Die Cutting Quote Now
From the 1940s until now, the electronics industry has exploded — and so has the need for die-cutting suppliers who adapt to changing designs and materials. By combining 75 years of knowledge with process improvements for modern substrates and layouts, we deliver legacy-level precision for the next generation of components.
If you’re looking for a supplier that can work with myriad materials, tight-tolerance designs, and a fair turnaround, request a quote today or call our VP Josh Rodman at (707) 769-4488. We’re ready to support your team — whether you know what you need, or need help shaping it.